Laser Marking Machine
DANA F10 series CO2 Laser Marking Machine
1. DANA F10 series are CO2 Laser Marking Machines for marking products on the high-speed production line, with basic formats of barcodes, two-dimensional codes, graphics, text, and these elements combination.
2. Applicable in a broad range of industries including pharmaceuticals, personal care products, tobacco, food and beverage packaging, alcoholic beverages, dairy products, electronic components, and chemical building materials, etc.
DANA F30 series Fiber Laser Marking Machine
Fiber laser marking machines, along with other types of laser marking machines, do not require consumables and can permanently mark the surface of objects. They are capable of marking a wide range of materials and are currently primarily used for metals and non-metallic materials with high ignition points.
DANA F20 series Ultraviolet Laser Marking Machine
DANA F20 series UV laser marking machine excels in ultra-fine marking on production line. The Ultraviolet laser's minute focus spot enables exceptionally fine printing, making it ideal for detailed marking on food and pharmaceutical packaging materials.
Desktop Dual-Laser Engraver - DANA Commercial Laser Marking group
The DANA-3020 Desktop Dual-Light Laser Engraver is a small laser engraving machine designed for commercial and personal use. With two laser modes built-in, the DANA-3020 can mark and carve on more than 300 kinds of materials. In addition to marking common product information labels, you can also easily printing pictures. It offers desktop and handheld working modes in one. The device is easy to use with mobile and PC operating software.
Portable Handheld Laser Marking Machine
In modern industrial production and on-site operations, an efficient, convenient, and multifunctional marking tool is crucial. Our portable handheld laser marking machine is meticulously designed to meet your marking needs in various scenarios.
Fiber static laser marking machine
Fiber Laser Marking Machines of DANA mainly adopt lasers customized specially for DANA, a high-performance galvanometer scanning system, and the control software developed by us has the advantages of fast speed, stable performance; good laser mode, and long service life, which can continuously work up to 100,000 hours with high electro-optic conversion efficiency and low power consumption. The system is simple to operate and flexible to upgrade. This product has multiple USB interfaces and is compatible with files from AUTOCAD, CORELDRAW, PHOTOSHOP, CAXA, and other software; do markings on Bar code, two-dimensional code, graphic text, and other marking, supports PLT, PCX, DXF, BMP, and other file formats; Use SHX and TTF fonts directly. The system can automatically generate code to mark serial numbers, batch numbers, date, etc.
CO2 static laser marking machine
CO2 laser marking machine, carbon dioxide laser marking machine, is a laser galvanometer marking machine using CO2 gas as the working medium. CO2 laser takes CO2 gas as the medium, charges CO2 and other auxiliary gases into the discharge tube and puts high pressure on the electrode. Glow discharge is generated in the discharge tube, so that the gas releases laser with a wavelength of 10.64um. After the laser energy is amplified, it is scanned by the galvanometer and focused by F-Theta (lens). Images, words, numbers and lines can be marked on the workpiece according to the user's requirements.
UV static Laser Marking Machines
Its working principle is that UV is a cold process with little thermal influence. By changing the molecular results on the surface of the object, a permanent mark is formed. The power pulse width output is stable, and the reaction of ultraviolet laser processing is realized by laser chemical ablation, relying on the laser energy to break the bonding between atoms and molecules, making them vaporize and evaporate into small molecules, thus forming the various identification information we need. Therefore, it is mainly used for ultra-fine marking and engraving, and is especially suitable for applications such as food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafer.